AnyPCBA PCB and PCBA case studies
Our client, a developer of advanced portable electronic systems for demanding environments, needed a high-reliability rigid-flex PCB that could integrate multiple rigid board sections with flexible interconnections. The design required a complex 12-layer structure, mixed surface finishes for different assembly requirements, and advanced via technologies.
Key Manufacturing Challenges:
Complex Rigid-Flex Structure: 12-layer board combining rigid and flexible sections
Mixed Surface Finish: ENIG (Electroless Nickel Immersion Gold) for SMT pads + selective HASL (Hot Air Solder Leveling) for through-hole components
Advanced Via Technologies: Blind and buried vias for high-density interconnections
Fine Lines and Spaces: 4/4mil line width/spacing for dense routing
Precision Mechanical Drilling: 0.25mm minimum mechanical hole size
Special Processing: Peelable mask for selective protection during assembly
Flex Area Reliability: Ensuring mechanical and electrical integrity in bend areas
AnyPCBA provided comprehensive PCB fabrication services for this rigid-flex board, from engineering review to final electrical testing.
Our manufacturing approach included:
Rigid-Flex Process Engineering: Specialized stack-up design and process control for the 12-layer rigid-flex structure
Material Selection: Carefully selected flexible substrate materials (polyimide) and adhesives for optimal bend performance and reliability
Mixed Surface Finish Process: Precision ENIG application for SMT pads with selective HASL for through-hole components
Blind and Buried Via Formation: Sequential lamination and controlled depth drilling for blind/buried vias
Fine Line Etching: Controlled etching process to achieve 4/4mil line width/spacing on both rigid and flexible sections
Flex Area Protection: Controlled routing and reinforcement for flex bend areas to ensure mechanical integrity
Peelable Mask Application: Selective application of peelable mask for process protection
Rigorous Testing: Comprehensive electrical testing and dimensional verification
| Parameter | Specification |
|---|---|
| Layer Count | 12 layers (rigid-flex) |
| Surface Finish | ENIG + Selective HASL (mixed) |
| Minimum Line Width/Space | 4/4mil |
| Minimum Mechanical Hole | 0.25mm |
| Special Processes | Blind and buried vias, peelable mask |
| Application | High-reliability portable electronic systems |
Successful Fabrication: Delivered high-quality 12-layer rigid-flex PCBs meeting all specifications
Mixed Finish Expertise: Demonstrated capability in selective ENIG + HASL surface finishing
Advanced Technology: Proven ability in blind/buried via and rigid-flex manufacturing
Flex Area Reliability: Ensured mechanical and electrical integrity in bend areas
Process Control: Achieved precise control for complex rigid-flex lamination and material handling
High-Reliability Solution: Delivered boards suitable for demanding, high-reliability applications
Rigid-flex PCBs offer significant advantages for advanced electronic designs:
3D Packaging: Enables folding and bending to fit complex enclosures
Weight Reduction: Eliminates connectors and cables between rigid sections
Improved Reliability: Fewer interconnection points means higher reliability
Space Savings: Ideal for compact, portable, and wearable devices
This case demonstrates AnyPCBA's capability to handle demanding rigid-flex fabrication challenges:
✅ Complex rigid-flex structures (12-layer, mixed materials)
✅ Mixed surface finishes (ENIG + selective HASL)
✅ Advanced via technologies (blind and buried vias)
✅ Special processes (peelable mask)
✅ High-reliability applications (aerospace, medical, defense, premium consumer)
Ready to discuss your rigid-flex PCB or complex design project? Contact us to learn how AnyPCBA can support your PCB fabrication needs.
