PCB Services

Customized solutions tailored to specific product requirements.
Optimization for signal integrity, power distribution, and electromagnetic compatibility.
3D modeling for mechanical fit checks.

Capabilities for high-density, multi-layer boards (up to 68 layers).
Specialty materials including high-frequency substrates (e.g., Rogers, Taconic).
Flex and rigid-flex PCB production.

Advanced surface mount technology (SMT) with placement accuracy down to 0.02mm.
Ball Grid Array (BGA) and Fine-Pitch BGA assembly.
Through-hole and mixed-technology assembly.

Access to a vast network of reliable suppliers.
Authentic component sourcing with full traceability.
Buffer stock management for critical components.