Our client, an industrial automation equipment manufacturer, needed a high-complexity control board for their next-generation machinery control system. The board required extremely high component density, mixed assembly technologies, and exceptional reliability to withstand harsh industrial environments.
Key Manufacturing Challenges:
Extreme Component Density: Over 2,300 solder joints and 400+ unique component types on a single board
Ultra-Fine Pitch Placement: 01005 passive components and 0.3mm pitch BGA packages
Mixed Assembly Technology: Combination of surface-mount (SMT) and through-hole components requiring dual reflow + selective wave soldering
Large Board Size: 17 x 18.7 cm board with stringent flatness requirements
Industrial-Grade Reliability: Must withstand vibration, temperature cycling, and continuous operation

AnyPCBA provided comprehensive manufacturing services for this industrial control board, from process engineering to full-scale production.
Our manufacturing approach included:
Precision SMT Assembly: Advanced placement equipment capable of 01005 components and 0.3mm pitch BGA with high accuracy
Specialized Soldering Processes: Double reflow for SMT components followed by selective wave soldering for through-hole parts, with custom fixture design to protect assembled areas
Process Optimization: Developed specific solder paste printing profiles and reflow temperature curves to accommodate diverse component requirements
Rigorous Quality Control: Implemented AOI, X-ray inspection (for BGA and hidden joints), and in-circuit testing (ICT)
Material Management: Systematic handling of 400+ component types to prevent mix-ups and ensure traceability
Reliability Assurance: Environmental stress testing and functional validation to ensure performance in industrial conditions
| Parameter | Specification |
|---|---|
| Total Solder Joints | 2,343 |
| Component Types | 402 |
| Board Size | 17 x 18.7 cm |
| Assembly Process | Double reflow + selective wave soldering |
| Minimum Component Size | 01005 |
| Minimum BGA Pitch | 0.3mm |
Successful Production: Delivered high-quality industrial control boards meeting all specifications
Process Capability: Demonstrated expertise in advanced assembly technologies (01005, 0.3mm BGA, mixed process)
Quality Assurance: Comprehensive testing ensured field reliability in demanding environments
Supply Chain Management: Efficient handling of 400+ component types without delays or errors
Manufacturing Excellence: Proven ability to handle complex, high-density, mixed-technology PCBA projects
This case demonstrates AnyPCBA's capability to handle the most demanding PCBA manufacturing challenges:
✅ Fine-pitch placement (01005, 0.3mm BGA)
✅ Mixed assembly processes (SMT + through-hole)
✅ High component variety (400+ types per board)
✅ Large board formats (up to 17 x 18.7 cm and beyond)
✅ Industrial-grade quality systems
Ready to discuss your industrial control or high-complexity PCBA project? Contact us to learn how AnyPCBA can support your manufacturing needs.